Electronics Packaging Components

Packaged devices for electronics assembly continue to become smaller and require ever more precise production processes for the manufacture of their components. Precision Micro is facilitating this change through the unique combination of manufacturing techniques it embraces.

In addition to precision lead frames, the Company manufactures a variety of stepped and plain flat lids for the hermetic sealing of ceramic packages and hybrid devices. Photo Etching produces high accuracy, burr free components that may be coated/plated to meet customer specifications.

Single source supply

• Reduces administration
• Minimises lead times
• Reduces costs

Available materials

• Kovar
• Alloy 42
• Stainless Steel
• Molybdenum

Available plating finishes

• Gold
• Nickel

Low/no cost phototooling

• Reduces lead times
• Allows design optimisation without financial penalty
• Helps realise a low risk entry strategy
• Makes short run, short life projects viable
• Low cost upgrades and changes
• LDI in the LEEP process removes need for phototooling

Ultra-fine tolerances

• Guarantee optimum sealing properties