Laser Evolved Etching Process

Laser Evolved Etching Process (LEEP) is a new and novel process route for manufacturing highly accurate micro components. The process, based on conventional photo etching, enables finer features and high complexity, to exceptionally tight tolerances measured in microns.

LEEP combines laser technology in the form of advanced Laser Direct Imaging (LDI) with the etching process to achieve new levels of accuracy and repeatability.

Minimum feature size is reduced but remains governed by material thickness and etch factors but the inclusion of LDI greatly improves positional accuracy across the sheet and importantly, back to front alignment, which can be a limitation in conventional etching is no longer a problem. Edges and apertures are crisper and cleaner when the image has been exposed by LDI.