Laser Evolved Etching Process
Laser Evolved Etching Process (LEEP) is a new and novel process route for manufacturing highly accurate micro components. The process, based on conventional photo etching, enables finer features and high complexity to exceptionally tight tolerances measured in microns.
LEEP combines laser technology, in the form of advanced Laser Direct Imaging (LDI), with the etching process to achieve new levels of accuracy and repeatability.
The inclusion of LDI greatly improves positional accuracy across the sheet, as well as back to front alignment, which can be a limitation in conventional etching. Edges and apertures are crisper and cleaner and the minimum "etchable" feature size is reduced.