Screening can helps identify assembly problem

Peel Lid Can
Customer requirement:

RF device screened with an ultra low profile screening can. In the event of a malfunction, customer needed to test device and inspect joints without removing the screening can by conventional desoldering methods. Conventional desoldering would hamper the investigation by imposing a further thermal cycle on the area under inspection
Ultra low profile, automated placement and space restrictions prevented the development of screening enclosure with separate lid.

Material:

Stainless steel

Solution:

• Precision Micro design engineers designed a low profile screening can that incorporated a perforated track around the top than enabled it to be ‘peeled back’ for inspection in the event of a mal-function.

Advantage

• New can met the dimensional requirements, could be used as a surface mount production component, yet offered a post failure destructive inspection facility.
• Solder joints could now be inspected after a mal function whereas removing the screening can by conventional reflow methods would have fundamentally changed the integrity of the solder joints.