EMI/RFI Shielding

The efficient operation of many electronics devices can be compromised by high frequency and electro magnetic interference. The board level solution to the problem is to keep RF (radio frequency) electromagnetic radiation confined inside or sealed out of a device through the use of a metal or metallised EMI/RFI shielding.

PRECISION MICRO has a wealth of experience in the design and manufacture of EMI/RFI shielding solutions and has pioneered technologies that have expanded both the scope and efficiency of on-board EMI/RFI shielding. Many 'Quiet features' can be incorporated in shielding can designs to improve attenuation and provide enhanced air-flow characteristics for easier re-flow soldering and improved device cooling in use.

PRECISION MICRO also manufactures a wide variety of bespoke shielding and continuity devices such as component and enclosure shields, conductive gaskets, ground contacts, vents, grilles and meshes, all manufactured with outstanding co-planarity for ease of assembly.

PRECISION MICRO has extensive experience in EMI/RFI shielding and is able to design, manufacture and test shielding solutions to ensure compliance with relevant standards.

Board level EMI/RFI shielding/screening One-piece RF shielding cans One-piece RF shielding cans with peelable top Two-piece RF shielding cans Multi-level RF shielding cans Labyrinth / multi-compartment RF shielding cans Ground clips Enclosure and connector shielding Conductive gaskets Ground contacts Shielding Vents, grilles and meshes Enclosure shields Connector shields

Design & compliance Material selection EMI/RFI shielding optimisation Earthing / grounding Compliance

Nickel Silver is fast becoming the preferred alloy for the majority of board level shielding tasks, replacing traditional plated steel and yellow metals across the board and certainly for those applications above 15 MHz where shielding effectiveness becomes more of a skin (conductivity) effect than a bulk effect.

Materials & Coatings

• Tin plated steel and other high permeability materials are considered the best choices for shielding low frequency applications (transformers, coils etc) while non-ferrous materials such as tin plated copper, phosphor bronze and beryllium copper are preferred above 200MHz (microprocessors, fast switching devices, power supplies etc).

• A wide range of materials are available from stock, including brass and stainless steel.

• Plating may be specified to improve the attenuation performance of  a shield while tin and solder plating are often used to enhance solderability preservation for trouble-free assembly.

• Dielectric coatings are available for insulating purposes.

Click here to download our EMI / RFI Shielding brochure