Laser Evolved Etching Process: Forming & Finishing

Combining LEEP with other in-house manufacturing processes provides finished components enabling customers to reduce their supplier base. Integrated Quality System (ISO 9001) assures optimum quality consistency and provides complete material and process traceability.

Forming

Forming is achieved by using standard, modular, readily available or easily fashioned form tools, reducing the commercial risk while shortening the lead times involved.

Components can also be formed without the expense of forming tools. This method is uniquely created when manufacturing the blank. During the process, a precision 'score' line is laid into the material which is controlled in accuracy, depth and width.

This 'score' line is then the basis for the form, ensuring form length and position, enabling the material to be formed, in some instances by hand. This forming method does not create the same stresses in the material as pressing and provides better coplanarity in components such as RFI screening cans.

Wear Resistance / Surface Hardness

Modifications can be achieved through heat treatment or the deposition of hard coatings such as Nickel or Chromium, nitriding CVD and ruthenium sputtering. Nickel/PTFE provides an inherent degree of lubricity.

Corrosion Protection / Solderability

From paint and powder coating to nickel and zinc cobalt, the range of available corrosion protective finishes is immense. Tin Lead and Tin coatings preserve solderability and gold and palladium are used similarly for high reliability applications.

Surface Appearance (roughness)

Grinding, polishing, linnishing, vapour blasting and other post machining operations are available on request.

Conductivity / Insulation

Electrical and thermal conductivity may be enhanced by the application of a functional coating. Gold may be used for special pcb connector applications whereas passivated Zinc Cobalt is more common for electrical connectors. A variety of laminates and resist coatings also provide dielectric properties.

Semiconductor Bonding

Gold and silver are used selectively to improve the efficiency of gold wire bonding and are used as a base for die attach on lead frames.

Optical / Cosmetic

Specific finishes can be requested; matt, bright, semi-bright etc for cosmetic purposes. Underlying surface roughness also has a marked effect on the appearance.

Post Manufacturing Assembly

A variety of assembly techniques is employed including forming, micro welding, adhesives/bonding etc to meet customer needs.