We specialise in shielding cans for a wide range of electronics applications, supplying prototype to volume direct to customers and distributors for nearly 60 years.
Though board level EMI/RF shielding cans can be manufactured in a variety of ways, our market-leading photochemical etching service offers distinct advantages, improving shielding functionality and lowering cost.
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Low set-up costs & fast delivery
We use low cost digital tooling, reducing time-to-market. Delivery can be from as little as a few days.
PCB shielding can complexity without cost
With chemical etching there is no limit to profile complexity or aperture array.
We can incorporate bend lines so components can be formed by hand, removing the need for hard form tooling, and add part numbers or logos at no additional cost.
EMI shielding materials and finishing
Nickel silver is the most cost-effective material choice for shielding cans as it can be soldered, will not oxidise and requires no additional plating.
Standard materials such as brass and mild steel are also available from stock, as well as in-house forming, assembly, spot welding, and tin, silver, nickel and gold plating.
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Benefits at a glance
- Low-cost tooling
- Fast delivery
- No limit to profile complexity or aperture array
- Bend lines, part numbers and logos at no additional cost
- In-house forming & finishing
- Nearly 60 years know-how
- One-piece screening cans
- Two-piece screening cans with removable lids
- Labyrinth (multi-compartment) screening cans
- Enclosure shields
- Conductive gaskets
- Shielding vents, grilles, meshes and windows