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Electronics Packaging Components

Packaged devices for electronics assembly continue to become smaller and require ever more precise production processes for the manufacture of their components. Precision Micro is facilitating this change through the unique combination of manufacturing techniques it embraces.

In addition to precision leadframes, the company manufactures a variety of stepped and plain flat lids for the hermetic sealing of ceramic packages and hybrid devices. Photo etching produces high accuracy, burr free components that may be coated/plated to meet customer specifications.

Single source supply

Available materials

Available plating finishes

Low/no cost phototooling

Ultra-fine tolerances