Photo etching has the flexibility and precision required to produce ultra-fine pitch, high pin count lead frames more cost effectively than conventional stamping technology.
Whilst EMI/RFI shielding can be manufactured in a variety of ways, photo etching offers distinct advantages, improving functionality and lowering cost.
Semiconductor cooling plates
Complex channels and geometries can be photo etched onto individual cooling plates economically, maximising thermal efficiency.
Flat, burr-free squeegee blades can be photo etched to ±0.025mm accuracy. Subsequent in-house electropolishing is available for a smoother surface finish.
Connectors and contacts
2-D and 3-D connectors and contacts can be photo etched from virtually any metal and post-process coated to improve wear resistance and enhance conductivity.
Shims, gaskets and washers
Photo etched shims, gaskets and washers are accurate to ±0.025mm, flat and burr-free, with no rough edges that could interfere with other mating components.
Springs, flexures and diaphragms
Photo etching ensures burr and stress-free springs can be manufactured with zero distortion or surface imperfections.
Benefits at a glance
- Unrivalled industry know-how
- 44,000 sq ft production etching plant producing over 50 million components annually
- Repeatability levels approaching Six Sigma standards
- Added value technologies for single source supply
As the demand for electronics grows, increased competition is driving down the costs of manufacture.
To remain competitive, manufacturers are looking to produce smaller, high precision parts, pushing the limits of traditional metal machining techniques. This means designers have had to look to new technologies in their quest for smaller, faster and cheaper components.
Miniaturisation, speed and economy
Photo etching is uniquely placed to meet the industry’s trend towards miniaturisation, speed and economy.
Highly complex, burr-free profiles and component features are possible to tolerances in the 1/100mm range. Part manufacture does not increase with complexity, which allows designers to focus on optimised part functionality rather than cost.
Using digital and easily re-iterated tooling rather than expensive and time-consuming steel tools, photo etching fits the low-risk product development strategy adopted by many electronics manufacturers and can move seemly from prototype to production in a matter of hours.
Trusted by the world’s leading electronics companies
Precision Micro has been at the forefront of electronics manufacture for over half a century. The company has been involved in a number of industry firsts, including fly-by-wire development for the automotive industry and lead frame etching for the world’s leading semiconductor packaging companies during the electronics boom of the 1990s.
Today, Precision Micro continues its association with some of the world’s leading electronics companies, supplying lead frames and weigh-reducing cooling plates to the semiconductor industry, EMI/RFI shielding for implantable defibrillators, surveillance UAVs and marine vessel positioning, lead frames for the world smallest reed relays, and micro-connectors, contacts and flexure springs for medical devices.
Economical volume supply
As one of the world’s few production etching specialist, Precision Micro has the resources to compete on a global scale – including low-cost Far East manufacture – and has the depth of resource to meet world-class levels of product quality, productivity, competitiveness and continuous improvement.
Single source supply
Precision Micro offers a variety of assembly techniques, including hard and hand forming, spot welding, brazing and diffusion bonding for single source supply. We also offer tin, silver, nickel and gold plating.